Please use this identifier to cite or link to this item:
http://thuvien.ued.udn.vn/handle/TVDHSPDN_123456789/34952Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | F. Jhon Burpo | vi |
| dc.date.accessioned | 2018-05-23T06:15:28Z | - |
| dc.date.available | 2018-05-23T06:15:28Z | - |
| dc.date.issued | 2012 | vi |
| dc.identifier.uri | http://thuvien.ued.udn.vn/handle/TVDHSPDN_123456789/34952 | - |
| dc.language.iso | en | vi |
| dc.publisher | MIT | vi |
| dc.title | Three Dimensional Virus Scaffolds for Engineer Storage and Microdevice Application | vi |
| dc.type | Book | vi |
| Appears in Collections: | Tin học | |
Files in This Item:
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
