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http://thuvien.ued.udn.vn/handle/TVDHSPDN_123456789/10771Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Zhengwen Li | vi |
| dc.contributor.author | Antti Rahtu | vi |
| dc.contributor.author | Roy G. Gordon | vi |
| dc.date.accessioned | 2015-08-13T08:13:06Z | - |
| dc.date.available | 2015-08-13T08:13:06Z | - |
| dc.date.issued | 2006 | vi |
| dc.identifier.citation | Journal of The Electrochemical Society, 153 11 C787-C794 2006 | vi |
| dc.identifier.uri | http://thuvien.ued.udn.vn/handle/TVDHSPDN_123456789/10771 | - |
| dc.language.iso | vi | vi |
| dc.title | Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor | vi |
| dc.type | Article | vi |
| Appears in Collections: | Hóa học (TC) | |
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